| 2.1.2.3 Board Support Package
A board support package is a software package that contains:
1. Boot Loader
2. OEM Adaptation Layer (OAL)
3. Device drivers for standard development board (SDB) or Hardware Reference Platform
BSP is the main part of Microsoft Windows CE based platforms and contains source files and binary files.
The OEM adaptation layer (OAL) that links to Kernel image and supports:
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Initializing and managing the hardware.
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Device drives.
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Boot loader.
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Set of configuration files.
Use of Boot Loader:
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Used during development to download Operating System image.
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Once created BSP can be reconfigured through environmental variables and .bib and .reg file can be modified to attain the reconfiguration.
Interaction Diagram:
Microsoft Platform Builder provides sample BSPs for many SDBs that are readily available in industry. By using the integrated BSP support, one can quickly evaluate the new Operating System features in Microsoft Windows CE.
BSP developments:
1. Extensive infrastructure is provided for developing BSP for SDB made by the developer or hardware.
2. Offers support for developing drivers for the platform.
3. Focus on customizing, refining and developing additional Operating System features.
Platform Builder provides BSPs for ten SDBs that are readily available for purchase. At present Platform Builder supports 4 types of BSPs which are the following:
1. ARM BSPs
2. MIPS BSPs
3. SHX BSPs
4. x86 BSPs
There are several third party BSPs that are available. Windows CE supported Thin Clients are also available commercially [ref 1].
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