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EEE 521: DECISION SUPPORT SYSTEMS
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| bet | 40/48 | | Sana | 02.01.2024 | | Hajmi | 327 Kb. | | #129611 |
Bog'liq BACHELOR OF SCIENCE ELECTRICAL ELECTRONICS ENGINEERINGEEE 521: DECISION SUPPORT SYSTEMS
Decision making, information theory, knowledge representation and knowledge systems, retrieval concepts and languages, decision support systems and development methodologies.
EEE 523: NONLINEAR AND MULTIVARIABLE CONTROL
Non-linear Control: Non-linear behaviour and describing function. Stability analysing describing fuctions, second, or direct, method of Lyapunov; Popov and circle criterial for stability. The phase-plane method. Introduction to optimal control, model-reference, and adaptive control strategies and their implementations. Multivariable feedback systems in the frequency domain: Introduction: generalization and extension of Single-Input/ single - Output to Multiple-/Multiple-Output Systems. Extension of the Nyquist Stability theorem to MIMO Systems; direct and inverse Nyquist plots. Direct and inverse Nyquist Array methods, The characteristic locus methods. Computer aided analysis and design of a multivariable systems is illustrated with a case design example using suitable control engineering software.
EEE 524: ADVANCED OBJECT ORIENTED PROGRAMMING
The concept of object-oriented (OO) user interfaces (UI), analysis for the UI, iterative steps of usability engineering to build, test, and refine multiple small-scale UI prototypes. Applications of OO analysis, software engineering, usability engineering techniques in systems development. Usability, quality, measurement, planning and management factors of software engineering.
EEE526: ELECTRONIC COMPUTER AIDED DESIGN AND MANUFACTURING TECHNIQUES
Computer aided design (CAD): Modelling of circuits and systems, modular simulation, gate array testing, one-off production techniques, interactive 3-D graphics design. Computer Aided Manufacturing (CAM): machine automation, process control, part inspection, automatic quality control. Manufacturing techniques: VLSI device level fabrication techniques, chemical and laser etching. Board level construction techniques; solder reflow, surface mount and mass production, packaging and testing.
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