• Figure 32: Speaker with amplifier reference circuit 4.7.3. Audio Electronic Characteristic Table 15: Microphone input characteristics
  • Table 16: Audio output characteristics Parameter Conditions Min Typ Max Unit
  • Speaker Interfaces Configuration




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    4.7.1. Speaker Interfaces Configuration 
    Figure 31: Speaker reference circuit 
    4.7.2. Microphone Interfaces Configuration 
    SIM800H&SIM800L_Hardware Design_V2.02 36 2015-07-27 


    Smart Machine Smart Decision 
    Figure 32: Speaker with amplifier reference circuit
     
    4.7.3. Audio Electronic Characteristic 
    Table 15: Microphone input characteristics 
    Parameter
    Min 
    Typ 
    Max 
    Unit 
    Microphone biasing voltage 
    1.9 
    2.2 

    Working current 
    2.0 
    mA 
    Input impedance(differential) 
    13 
    20 
    27 
    KΩ 
    Idle channel noise 
    -67 
    dBm0 
    Input level:-40dBm0 
    29 
    dB 
    SINAD 
    Input level:0dBm0 
    69 
    dB 
    Table 16: Audio output characteristics 
    Parameter 
    Conditions 
    Min 
    Typ 
    Max 
    Unit 
    R
    L
    =32 Ω receiver 

    90 

    mW 
    Normal output 
    R
    L
    =8 Ω speaker 

    -
    1080 
    mW 
    4.7.4. TDD 
    Audio signal could be interferenced by RF signal. Coupling noise could be filtered by adding 33pF and 10pF 
    capacitor to audio lines. 33pF capacitor could eliminate noise from GSM850/EGSM900MHz, while 10pF 
    capacitor could eliminate noise from DCS1800/PCS1900Mhz frequency. Customer should develop this filter 
    solution according to field test result. 
    GSM antenna is the key coupling interfering source of TDD noise. Thereat, pay attention to the layout of audio 
    lines which should be far away from RF cable, antenna and VBAT pin. The bypass capacitor for filtering should 
    be placed near module and another group needs to be placed near to connector. 
    Conducting noise is mainly caused by the VBAT drop. If audio PA was powered by VBAT directly, then there 

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