Oltin fond 2021, 1-son




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OLTIN FOND JURNALI 1-SON oxirgi
Farhod Sultonov, Farruh Bozorboyev. O\'zbekiston hukmdorlari
 
 
2021, 1-son 
 
 
30 
 
ILM SARCHASHMALARI 
 
DEVELOPMENT AND METHOD FOR RESERVOIR STENCILS 
WITH RELIEF AREAS 
Dr. Michele Gaddy 
The academic director of Karshi Presidential School
Abstract. A stencil comprising two or more layers is described for applying 
surface mount materials onto printed circuit boards, flexible circuits, wafers or other 
substrates. The stencil can accommodate preexisting surface mount components and 
materials. The stencil utilizes material reservoirs, relief areas and delivery apertures 
and can be used for depositing surface mount materials such as adhesives, conductive 
glues, solder paste and solder balls. 
Description. The surface mount technology (SMT) assembly industry requires 
the application of surface mount materials such as adhesives and solder onto printed 
circuit boards (PCBs), flexible circuits and wafers. Components are glued in place on 
the PCB before normally going through a wave solder process to solder the 
components to the PCB. One of the methods of depositing glue onto the PCB is with 
a glue dispensing machine. This is a sequential process where glue is dispensed 
through a fine orifice point by point under control of an X-Y positioning machine. 
Glue and solder printing can also be done by stencil printing, which is a parallel 
process. Material is applied to a stencil and then forced onto a substrate through 
openings in the stencil.
These current techniques generally lack the flexibility to handle the variety of 
shapes and heights of glue and solder paste deposits which may be needed due to the 
diversity of components that are often used. For example, a 0603 chip component 
may require a glue deposit 13 mils wide by 33 mils long by 8 mils high. At the same 
time, a plastic leaded chip carrier (PLCC) may require a glue deposit 60 mils wide by 



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